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FEATURES AND SPECIFICATIONS
EdgeLineTM 12.5 Gbps Edge Card Connector 76421 108 Circuits, PCB Mating Thickness 2.36mm (.093") 76691 Multiple Circuit Sizes PCB Mating Thickness 1.57mm (.062") 76693 Multiple Circuit Sizes PCB Mating Thickness 2.36mm (.093")
EdgeLineTM 12.5 Gbps Edge Card Connector delivers a low-cost, flexible and scalable solution for a wide variety of low-to mid-range telecom, computing, and storage applications The new one-piece EdgeLineTM 12.5 Gbps Edge Card Connector is designed to meet the demands of highspeed signal transmissions and density requirements. The connector system accommodates two board thicknesses to support multiple PCB layers on complex product designs. The press-fit connector offers high-speed differential performance up to 12.5 Gbps. In addition, the EdgeLineTM connector has the capability to optimally manage slower speed single-ended and power circuits. The stitched-terminal design offers both excellent electrical performance and product flexibility. Various Features and Benefits n High-speed differential design provides excellent signal integrity, performance up to 12.5 Gbps, depending upon the application n Accommodates 1.57 or 2.36mm (062 or .093") thick PCBs to allow thicker boards to support more PCB layers on complex product designs n Cost-effective stitched terminal provides product flexibility to accommodate various signals and power n Press-fit, flat-rock tool ensures easy board termination with robust electrical termination n Common or singulated ground optimizes connector for power and slow-speed, single-ended signals in addition to high-speed differential circuits n Center key available on certain circuit sizes improve PCB alignment during mating by relaxing board tolerances up to 0.80mm (.031") pitch n "Chevron" differential pattern allows "route through" for multilayer backplane applications circuit sizes are available, with or without a center key. The EdgeLineTM 12.5 Gbps Edge Card Connector is available in two PCB thicknesses, 1.57 and 2.36mm (.093 and .062"), with future capability to mate to a 2.00mm (.079") thick PCB. Configured to meet Telecordia requirements, the EdgeLineTM 12.5 Gbps Edge Card Connector can fill many interconnect requirements. For more information on EdgeLineTM 12.5 Gbps Edge Card Connector, visit: www.molex.com/link/edgeline.html.
SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: 1827355 (LR 19980) Mates With: Customer Plug-in Card Product Specification: PS-75594-999 Electrical Voltage (max.): 250V AC Current (max.): 1.5A Contact Resistance: 10 milliohms max. Dielectric Withstanding Voltage: 300V AC Insulation Resistance: 10 Megohms min. Mechanical Insertion Force to PCB: 35.6N (8.00 lb) per pin Durability: 200 cycles min. Physical Housing: Glass Filled Thermoplastic, 94-VO, Black Contact: Copper (Cu) Alloy Plating: Contact Area -- 0.76m Gold (Au) min. Solder Tail Area -- 0.76m to 1.52m Tin (Sn) Underplating -- 1.27m Nickel (Ni) min. Operating Temperature: -40 to +85C
APPLICATIONS
EdgeLineTM 12.5 Gbps Edge Card Connector 76421 108 Circuits, PCB Mating Thickness 2.36mm (.093") 76691 Multiple Circuit Sizes PCB Mating Thickness 1.57mm (.062") 76693 Multiple Circuit Sizes PCB Mating Thickness 2.36mm (.093")
n Computing systems n Storage systems n Telecommunication hardware n Networking equipment n Supports many high-speed differential interfaces - PCIe - SAS - SATA - Others
ORDERING INFORMATION
Order No. 76421-1000 76691-2108* 76693-2278* Circuits 108 278 200 PCB Mating Thickness 2.36mm (.093") 1.57mm (.062") 2.36mm (.093") Plant No. for Samples #3109 Contact Product Manager
Note: *Multiple circuits are available within this product series; see sales drawing for options.
www.molex.com/link/edgeline.html
Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com
Order No. 987650-2584
Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 apninfo@molex.com
Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 apsinfo@molex.com
USA/KC/2008.11
European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com
Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. P: 630-969-4550 F: 630-969-1352
(c) 2008, Molex

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